Apple's A20 Pro chip leak shows 7-core GPU and new WMCM packaging

Apple is expected to unveil its first 2 nm SoC, the A20 Pro, at the September 9 "Surprise and Shine" event. A front-side die photograph shared on Weibo reveals that the chip may feature a seven-core GPU, a step up from previous models, and that Apple has moved from its older InFO_PoP packaging to wafer-level multi-chip module (WMCM) technology. The new layout places memory dies beside the processor die rather than stacking them, allowing the memory interface to widen to 96 bits while still using LPDDR5X memory.

The CPU core count appears unchanged, with two performance cores and four efficiency cores, each performance core retaining a 16 MB L2 cache and the efficiency cores gaining an 8 MB L2 cache, up from 6 MB in the A19 Pro. Apple has also hinted at a larger Neural Engine, though details remain undisclosed.

Analysts note that the packaging change could boost graphics performance without requiring a shift to the more expensive LPDDR6 standard, though power-efficiency impacts have not yet been measured. The A20 Pro is slated for the iPhone 18 Pro, iPhone 18 Pro Max and Apple's forthcoming foldable iPhone model, with further specifications expected after benchmark testing following the event.

"The WMCM approach lets us increase the memory bus width to 96 bits while keeping the LPDDR5X standard," a source familiar with the leak said.

Apple's official announcements are anticipated on September 9, after which more detailed performance data should become available.