Apple's upcoming A20 Pro chip may debut 2nm process and new wafer-level packaging

Apple is preparing the A20 Pro processor for the iPhone 18 Pro and iPhone Ultra slated for release later this year. Industry analysts say the chip will be manufactured using TSMC's new 2-nanometer process, a step down from the current 3-nanometer technology, which should allow greater performance and efficiency within a similar footprint.

In addition to the smaller node, the A20 Pro is reported to adopt a wafer-level multi-chip module (WMCM) packaging approach. This method integrates the system-on-chip and memory dies directly at the wafer level, eliminating the need for an interposer or substrate and potentially improving thermal management and signal integrity.

The combined effect of the 2nm process and WMCM packaging is expected to boost AI processing and high-end gaming performance while reducing power consumption, aligning with Apple's focus on AI-centric features in the upcoming iOS 27 operating system. > "For the first time, Apple is set to adopt Wafer-Level Multi-Chip Module (WMCM) packaging for its iPhone processors," said Marcus, a source familiar with the development.